Lead-Free, no-clean, water soluble Universal no-clean solder pastes that conform to customer processes as well as environmental regulation. Cookson Electronics offers a full line of all-around ALPHA� solder pastes that covers the complete range o
New Equipment | Solder Materials
Alloy: SAC 305, Mesh: -325+500, 250 gram Jar. Buy the jar, while supplies last.
New Equipment | Solder Materials
Made for high speed leaded assembly. No Clean Solder Paste, Alloy: Sn63/Pb37, Type 3 Powder -325+500, 250 gram jar. Buy one or two jars on line. While supplies last.
New Equipment | Solder Materials
We are a distributor of Qualitek. We offer the following lead and lead free solder pastes: 717D Water Soluble Solder Paste Syringe (10cc Syringe) 619D No-Clean Solder Paste Syringe (10cc Syringe) 718D Water Soluble Lead Free Solder Paste
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
New Equipment | Solder Materials
8 hrs. @ 30–45% RH & 22–25°C ~6 hrs. @ 45–70% RH & 22–25°C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Proce
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
Specialty Solder Products for SMT Assembly- Solder Paste (No-Clean, Water Wash), Solder Spheres, Fluxes, Preforms, Wire, Ribbon.
New Equipment | Solder Materials
Cookson Electronics offers a full line of all-around ALPHA® solder pastes that covers the complete range of applications, including no-clean, water soluble and lead-free solder paste technologies.
New Equipment | Solder Materials
Paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering. BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Four types
