New SMT Equipment: open solder voids (Page 6 of 8)

AMTECH Tacky Paste Fluxes

AMTECH Tacky Paste Fluxes

New Equipment | Solder Materials

AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t

AMTECH

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Component Testing & Verification

New Equipment | Test Equipment

Vigilant provides an array of component testing and verification services. Not only do we test and verify all electronic components we source, but we can also provide a full component test and  verification service for components our customers have p

Vigilant Components

SPI 2500 3D Solder Paste Inspection System

SPI 2500 3D Solder Paste Inspection System

New Equipment | Inspection

The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V

PARMI

LPKF ProtoLaser - PCB Laser Etching Systems

LPKF ProtoLaser - PCB Laser Etching Systems

New Equipment | Prototyping

The next generation of in-house prototyping Laser-based PCB production can achieve much greater circuit detail, and lasers structure circuits significantly faster. This technology provides true on-demand production solution for both prototyping and

LPKF Laser & Electronics

Assembly systems

Assembly systems

New Equipment | Assembly Services

ENGMATEC provides solutions for the most different production processes, from assembly to packaging. Depending on requirements, ENGMATEC designs assembly systems from the single workstation to high-volume production. Economically viable automatio

ENGMATEC GmbH

Reflow oven

Reflow oven

New Equipment | Reflow

Heating system (Heller 1812EXL ) 1. All the heating zones are controlled by PLC through PID 2. Heating separately according to different zones is workable to reduce starting power. 3. Turbo air system can improve air flow and provide high rising t

V-soltes Electronic Equipment Co.,Ltd

Flying Scorpion FLS980Dxi -

Flying Scorpion FLS980Dxi -

New Equipment | Test Equipment

Application of new and innovative design features to increase test speed, board access, reliability, and repeatability, have opened up new possibilities for deployment of Acculogic's FLS900 series testers. As the first patented flying prober with dou

Acculogic Inc.

ScanNavigator™: Fully Integrated Boundary Scan Test Environment

ScanNavigator™: Fully Integrated Boundary Scan Test Environment

New Equipment | Software

A leading suite of powerful tools for boundary scan testing and programming based on the original JTAG standard, IEEE 1149.1. ScanNavigator harnesses the power of Acculogic’s comprehensive set of boundary scan test and on-board device programming t

Acculogic Inc.

S2088-II F – Desktop AOI with 8M Camera Technology and Angular Cameras

S2088-II F – Desktop AOI with 8M Camera Technology and Angular Cameras

New Equipment | Inspection

Reliable optical inspection of wave, reflow, pre-reflow and selective soldering. More than an entry into AOI Optimal, ergonomic loading through large opening angle  Superior resolution, reliable 01005 and fine-pitch inspection Scalable camera t

Viscom AG


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