The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
This module contains all SMT Plus Inc. standard components in EPD/AutoCAD library form. Visual and parametric libraries are provided. Just point and select a desired component from the hundreds of parts available and insert it into your layout drawi
Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco
Design For Test AB Electronic Assemblies Ltd (ABEA) provides assessment of PCB design in order to maximise testability on either Genrad or Teradyne. This includes recommendations in the following areas: General PCB layout Suitable test point densit
Enefco offers contract cutting to other manufacturers and distributors. We have continually shown the ability to source, manufacture, process, and package a diverse line of products. From flexible foams to high-density non-woven goods, we have provi
High-density SRAM, Flash, EEPROM, and DRAM in BGA, QFP, SIMM, DIMM, PLCC, flatpack, ZIP, SOIC, DIP, and other packages. PC Cards. High-reliability packaging for extreme environments and military applications.
New Equipment | Design Services
Flex & Rigid-Flex circuits can be shaped to fit where no other design can. They are a hybrid of ordinary printed circuit boards and round wire, exhibiting benefits of each. In essence, flexible circuits give you unlimited freedom of packaging geome
Parmod�, Parelec Inc�s patented conductive ink technology, enables the formation of continuous-phase pure metallic conductors at relatively low temperature�making them suitable for application to polymer substrates. Parmod� inks, pastes and toners ca
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
