SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
0.15mm diameter). Adhesives Highest precision, even for delicate conductive adhesives with relatively large particles. Trouble free precision processing of abrasive media. Dispenser head heating prevents ‘stringing’. Potting Compou
For flip chip attachment of RFID and smartcard IC’s Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applicati
New Equipment | Test Equipment
The top Automated Test Equipment manufacturers count on Circuit Check. We fabricate and customize in-circuit fixtures for testers made by Keysight Technologies, GenRad, Teradyne and others. Customers know they can come to us for the latest technolog
Nanovea offers clients worldwide to an unmatched range of Nano, Micro & Macro Mechanical, Metallurgy, Tribology and 3D Non-Contact or AFM materials characterization. Measurements include: Scratch Adhesion, Indentation Hardness, Wear Friction, Elastic
Molex's membrane switches provide durable, lightweight and low-profile options for integrating user interfaces and electronic components into a variety of applications including medical, industrial and commercial products. Molex standard membrane s
New Equipment | Test Equipment
High Accuracy, In-Circuit Test and Functional Test with IEEE, PXI, Boundary Scan and Flash Programming capability for all NPI and Electronic Manufacturing environments, Visiontest, optional fixture capability The Latest Technology in Flying Probe T
New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
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