New SMT Equipment: pad width (Page 1 of 4)

HDI PCB, High density PCB, High density interconnect PCB, HDI PCB Manufacturing -- Hitechpcba

HDI PCB, High density PCB, High density interconnect PCB, HDI PCB Manufacturing -- Hitechpcba

New Equipment | Fabrication Services

HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri

Hitech Circuits Co., Limited

Aluminum PCB; Metal Core PCB; LED PCB Circuit board -- Hitech Circuits Co., Limited

Aluminum PCB; Metal Core PCB; LED PCB Circuit board -- Hitech Circuits Co., Limited

New Equipment | Fabrication Services

Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l

Hitech Circuits Co., Limited

Circuit Trace Repair Kit

Circuit Trace Repair Kit

New Equipment | Rework & Repair Equipment

The BEST PCB circuit trace repair kit gives you the tools you need for fast modification and repair of PCB circuit traces. Our online PCB repair training videos, our master instructors along with these materials allows you to meet the original PCB qu

BEST Inc.

The bugler stamp pad Manual screen printing machine

The bugler stamp pad Manual screen printing machine

New Equipment | Assembly Services

The bugler stamp pad Manual screen printing machine Product name: hand machine (medium) Applicable objects: SMT Substrates thickness range: 0.1 ~ 100 (mm) Product type: brand new Printing color: monochrome Printin

Goodluck Electronic Equipment Co.,Ltd

Via-in-Pad

Via-in-Pad

New Equipment | Assembly Services

10-Layer Via-in-Pad Technology PCB features blind via in L9-10 in addition to the Fine Pitch BGA. Putting the via in the pad creates space on the external layers for more routing and avoids potential shorts during assembly. The routing channel widt

Saturn Electronics Corporation

PCB Manufacturing - USA

PCB Manufacturing - USA

New Equipment | Assembly Services

Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e

PNC Inc.

8 layers PCB with blind buried vias

8 layers PCB with blind buried vias

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads

CYZON LIMITED

10 layers HDI PCB prototype blind and buried holes board(2+6+2)huanyupcb.com

10 layers HDI PCB prototype blind and buried holes board(2+6+2)huanyupcb.com

New Equipment | Prototyping

Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com.  HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch

PCB Manufacturer HuanYu Technologies Co., Ltd.

8 layers 1-stage HDI board huanyupcb.com

8 layers 1-stage HDI board huanyupcb.com

New Equipment | Prototyping

Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com.  HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch

PCB Manufacturer HuanYu Technologies Co., Ltd.

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

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pad width searches for Companies, Equipment, Machines, Suppliers & Information

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Thermal Transfer Materials.