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Smt Hitachi nozzles sigma-G4 Sigma-G5 nozzles used in pick and place machine Hitachi GXH-1, GXH-3 Nozzles Part Number Description 630 128 4842 (#101) HA01 0.7x0.4/ø0.25 (for 0603) 630 132 2322 (#111) PV01 1.1x0.6/ø0.38 (for
The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde
SIGMA Link is a powerful web-based software suite currently structured around 3 modules: SIGMA Import | SIGMA Review | SIGMA Analysis SIGMA Link is a continuous yield improvement tool to translate SPI and AOI inspection data into useful process inf
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
0.3μm No Damage: SO.I Volt CV-shift Uniformity: 100mm : ± 3% (5% 3 sigma) • 150mm : ± 5% (8% 3 sigma)• max.- min. /2 x average
Compact Pemium Modular Printer Printing accuracy of +/- 20μm is achieved. All operations can be performed from the front panel, improving operability and maintenance. The automatic backup pin setup function significantly reduces setup ti
The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V
New Equipment | Test Equipment - Bond Testers
The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Full automation, 0.075% accuracy, best ergonomics, highest throughput, vision options,
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