The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
S & B CONTROLS 38111500500000 TEMP.CONTROLLER S & B CONTROLS 38111501401110 TEMP.CONTROLLER S & B CONTROLS PRCQ1-00-1000 TEMP.CONTROLLER S & B CONTROLS RCQ4-00-2222-08 DIGITEMP MC S & B CONTROLS RCQ4-21-2222-08 DIGITEMP MC S & B C
| 1 |
