New Equipment | Solder Materials
8 hrs. @ 30–45% RH & 22–25°C ~6 hrs. @ 45–70% RH & 22–25°C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Proce
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
New Equipment | Solder Materials
Low melting temperatures prevent loss of properties and minimize distortion on thin wires and sheets. KappZapp3.5™ Tin-Silver alloys are used for electronics, fabrication, ducting, food containers, storage bins, instruments, Copper plumbing pipe, and
EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle
New Equipment | Solder Materials
The KappZapp4 - 4% Silver formula is often preferred for hand soldering Stainless and Copper parts. It has a wider slushy or plastic range to allow users to manipulate parts during cooling. Low melting temperatures prevent loss of properties and mi
New Equipment | Solder Materials
The KappZapp7 - 7% Silver formula is an audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance. Low melting temper
New Equipment | Board Handling - Storage
SEIKA: Low Humidity Storage, PCB Routers and Digital Microscopes McDry Ultra-Low Humidity Storage Cabinets PCB Routers / Dry Slicers Fully Automated Stencil Cleaners & Nozzle Cleaners Ultrasonic Wiper Roll Cleaner / Solder Paste Recy
New Equipment | Solder Paste Stencils
PNC Inc. uses LPKF Laser Technology to manufacture SMT Solder paste stencil, high tolerance aperture openings with superior registration for it’s solder paste stencils. With it’s 4 mil beam diameter, our Laser is capable of cutting small aperture ope
PSAN The PSAN� solution extends the PCI bus beyond the server to external storage devices. Now there is competition for Fibre SANs. Why use your entire IT budget on a Fibre solution to get slower throughput and higher costs.� By utilizing a PSAN� sol
500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo
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