Insulates, protects against weathering, prevents from breakdowns, preserves rubber, plastics, features a wide range of operating temperatures: from �50�C to 200�C, good chemical resistance to oxidation, water solutions of acids, bases, sulfur dioxide
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Discover the Industry's Highest Performing True3D SPI Solutions FIND OUT WHY SO MANY MANUFACTURERS IN NORTH AND SOUTH AMERICA RELY ON KOH YOUNG SPI SOLUTIONS Did you know a majority of printed circuit board (PCB) defects occur during solder printin
New Equipment | Solder Paste Stencils
We use fine grain stainless steel for the base of all our Stencils, All Stencils are cut on LPKF lasers which ensures the best quality for optimum paste release. Our Stencils are offered in thicknesses from .0015" to .0020". Our laser cut Stencils c
This simple printer is SMT dedicated process equipment for screen printing or leakage printing. The printing process is completed manually. It is low-cost, easy to use, easy to learn, high efficiency and suitable for small batch, research & developme
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3
Henkel's diverse portfolio of adhesive and sealant solutions includes advanced materials technologies to address today’s most demanding applications. From electrically conductive and non-conductive paste adhesives through to thermally conductive diel
The SMT 8200SPI and 8200CPI are laser-based inspection systems. The 8200 meets the most demanding cycle time requirements with 100% inspection of solder paste or component placement. Using a 3D scanning laser, the 8200 can detect solder paste volum
Sn/3.5Ag, Sn/0.7Cu, Sn/3.9Ag/0.6Cu, Sn/2.0Ag/0.7Cu (for Bar, Wire, Paste, BGA & Anode); Sn/Sb (for Bar); Sn (for Bar, Wire & Anode); Ni/Pd (for Bar, BGA & Anode); Conductive Adhesive (for Paste).
New Equipment | Cleaning Equipment
Rapidly and effectively removes solder pastes, adhesives and flux residues. Completely air driven Misprint Cleaning System. Very simple and fast installation and operation. Board sizes up to 455 x 305mm - single vertical. Solder paste and flux re
