New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
PBGA,CABGA,CTBGA,FBGA,Metal BGA,uBGA,Super BGA,Stack BGA
New Equipment | Rework & Repair Services
Our shortest turnaround-Time for BGA Rework / Reballing Services is within 24 Hrs. We are capable of reworking precision complex components such as shown below:(1) Any type of land grid array package and/or socket, including PBGA, CBGA, CCGA, High I/
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
New Equipment | Solder Materials
BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy. Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UM
Ball Grid Array X-Ray Inspection Guide - 20 Colour Charts Includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white. The posters are provided as a pdf file and can be printed as A4 or A3
New Equipment | Solder Materials
New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accura
New Equipment | Rework & Repair Equipment
Scotle IR360 PRO is a 2 in 1 BGA rework station which can be used as infrared BGA rework station and hot air BGA Rework station with three independently temperature zones. Users can use total different BGA rework system only in one BGA rework station
New Equipment | Rework & Repair Equipment
Specification: Rated Power: 4000W Rated voltage:AC220V /AC110V optional The first upper zone power: 800W Second temperature lower power: 800W Lower part of the preheating temperature zone Power: 2400W Dimensions: L500mm * W420mm * H550mm Weigh
