New SMT Equipment: pcb cte (Page 1 of 1)

Thermally Managed - Heat Dissipating Printed Circuit Board Technology

New Equipment |  

Thermally Managed � Heat Dissipating PCB�s (Printed Circuit Boards) By STABLCOR Corporation STABLCOR TM Printed Circuit Board Material Product Information STABLCOR Corporation has developed a new printed circuit board technology that has the followin

ThermalWorks

STABLCOR

STABLCOR

New Equipment |  

STABLCOR� is a Thermally Managed PCB / Substrate material technology with many benefits: High Thermal Conductivity with a product family that ranges from 100 W/m K up to 1000 W/m K Can more closely match the CTE mismatch that is common today bet

ThermalWorks

Isola - High Performance PCB Laminates

Isola - High Performance PCB Laminates

New Equipment | Materials

FR408 High Speed, Low Loss Modified Epoxy FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for br

INSULECTRO

KIC Aluminum Tape - Solution for Reliable Thermocouple Attachment

KIC Aluminum Tape - Solution for Reliable Thermocouple Attachment

New Equipment | Components

Don't Sacrifice PCBs for Profiling Double Sided Thermally Conductive Tape Used for Attaching Thermocouples to PCBS. Non-destructive TC attachment Reliable TC readings No waiting for curing or soldering Fast, easy setup Sold in 1

KIC Thermal

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

New Equipment | Materials

500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo

Integral Technology, Inc

DUPONT™ - High Performance PCB Laminates (HPL)

DUPONT™ - High Performance PCB Laminates (HPL)

New Equipment | Materials

Pyralux® LF Copper-clad Laminate DuPont™ Pyralux® LF has been an industry standard in high reliability applications in the avionics industry for over 30 years and has a proven record of consistency and dependability and is ideal for aerospace and m

INSULECTRO

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

New Equipment | Test Equipment

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us

Akrometrix

PCB & Semiconductor Packaging Materials.

PCB & Semiconductor Packaging Materials.

New Equipment | Materials

Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian

i3 Electronics

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pcb cte searches for Companies, Equipment, Machines, Suppliers & Information

Precision PCB Services, Inc
Precision PCB Services, Inc

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider

1750 Mitchell Ave.
Oroville, CA USA

Phone: (888) 406-2830

Best SMT Reflow Oven

High Precision Fluid Dispensers
PCB Handling with CE

High Throughput Reflow Oven
Thermal Interface Material Dispensing

World's Best Reflow Oven Customizable for Unique Applications
Fully Automatic BGA Rework Station

"回流焊炉"