One of the UK's leading CEM's specialising in Automatic Assembly of Surface Mount & Leaded PCB's. We are a family business dedicated to the highest levels of service & Customer Satisfaction. We also provide a complete turnkey service from Electroni
BQC is an electronic manufacturing service (EMS) provider located in Shenzhen, China. We are providing total outsourcing solution to our international clients through value engineering and interactive design. BQC offer a full range of electronic ass
QEMS provides a full range of services to the OEM; from box build, circuit board assembly, PCB design and design for manufacturing, and test to wire and cable assembly. QEMS is minority-owned and located in Monroe, NC.
JRE, Inc. is a provider of Contract Electronic Assembly Manufacturing Services. Quick turn as well as volume production capabilities for SMT, Fine Pitch placements, BGA and micro BGA, Thru- hole, Hybrid, RF, complete turn-key and box builds. Servic
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
MLT provides rigid and flexible circuit laser services including laser routing (excising), cavity skiving, coverlay/coverfilm routing, microvia drilling, ZIF Contours, Kapton window skives, depaneling, and marking. With 20 years experience, MLT has
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
Manufacturer / Consultant / Service Provider
3240 Scott Blvd
Santa Clara, CA USA
Phone: +1 408 980 0400
