New Equipment | Solder Paste Stencils
Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive-backed stencil on to a ci
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F
Features: Apply to Korea rolling high-speed guide-rail and scraper, which derived by frequency conversion variable speeds motor, in order to make sure printing precision. Scraper can slide back and forth to choose printing position. Honey
TP300 is the simplest solution, the most compact-size and lowest-cost solder paste printer, it can be easy and accurate to print the solder paste on any board. Please see details below: 1). It is suitable for both single-sided and double-sided p
Base material: FR4 Layer count: four layer Board thickness: 1.6mm Copper thickness: 2 oz Surface finish: Immersion Gold Solder mask color: Green Sizes: 262 x 185/1up
Double-sided Aluminium PCB Layer count: 2 Material: Bergquist HT-04503 Aluminum Board thickness: 1.6mm Copper thickness: 1oz Thermal conductivity: 2.2W/m-K Breakdown voltage: 6.0KV Application: LED light
New Equipment | Fabrication Services
Layers: 2 Base material: FR4 Copper thickness: 1oz Board thickness: 1.6mm Min. hole size: 0.45mm
New Equipment | Wave Soldering
TW3 is the best benchtop wave solder machine with the most cost-efficiency, but it is functional over your expection, fully like the full-size wave solder machine, Please see details below: 1). It can run either leaded or lead-free process, its enti
Base Material: FR4 Layer count: four layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: Immersion Gold Soldermask Colors: blue
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830