New Equipment | Education/Training
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
New Equipment | Education/Training
Component Rework/Board Repair Training This is a 5-day, advanced course for anyone responsible for quality and reliability of reworked or repaired electronic assemblies. It is a comprehensive hands-on training program with 80% lab work. The certific
New Equipment | Education/Training
Component Rework/Board Repair Training This is a 5-day, advanced course for anyone responsible for quality and reliability of reworked or repaired electronic assemblies. It is a comprehensive hands-on training program with 80% lab work. Attendees m
New Equipment | Education/Training
This 4-day, lectured course utilizes the images in the IPC-A-610 document to provide visual accept/reject criteria examples for all three classes of assembly production–for both lead and lead-free. The IPC-A-610, “The Acceptability of Ele
New Equipment | Education/Training
This 3-day, lectured course utilizes the images in the IPC-A-610 inspection document to provide visual accept/reject criteria examples for all three classes of assembly production–in both lead and lead-free. The IPC-A-610, “The Acceptabil
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Test Equipment
The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution o
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
