New SMT Equipment: qfn aperture (Page 1 of 1)

APR Component Printing Metal Stencil

APR Component Printing Metal Stencil

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin

BEST Inc.

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

Indium8.9 Pb-Free Solder Paste

Indium8.9 Pb-Free Solder Paste

New Equipment | Solder Materials

Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t

Indium Corporation

SMT Stencils

SMT Stencils

New Equipment | Solder Paste Stencils

Fine Line Stencil is a technology leading manufacture, committed to delivering the highest quality laser stencils in the industry.  We use the most advanced laser and material technologies available in the world to meet current and future industry de

FCT ASSEMBLY, INC.

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

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