SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
Multilayer, double sided, flex, flex-rigid, metel core, heatsinks. For the military, aerospace, industrial control and medical industries.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
* Provides support to PCB preventing substrate distortion * Prevents bottom side components from double-sided reflow * Eliminates operator intervention for screening, placement, and reflow * Transports odd-shaped PCB through conveyor * Accurately loc
Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt
New Equipment | Board Handling - Pallets,Carriers,Fixtures
* Provides support to FPC preventing substrate distortion * Prevents bottom side components from double-sided reflow * Eliminates operator intervention for screening, placement, and reflow * Transports FPCs through conveyor * Durable, high temperatur
Stand alone Semi-Automatic Stencil Printers with optional Accu-Lign Series Vision Alignment featuring " Train on Paste " capability to make set up a snap. Also available Programmable Squeegees and Under Stencil Wiper Module. 4 Available Vision L
Ridgid, bare board manufacturing of military, high reliability, quick-turn, prototype, single, double-sided, and multilayer boards, blind and buried vias, carbon ink, immersion silver, immersion tin, reflow, hasl, nickel and gold, all colors of legen
*Controlled convection with N2 option. *1-profile system. *More than 2 m process length. *Multijet air flow technology for excellent zone separation. *Volumetric and temperature controlled heat transfer *Highly stable temperature environment *C
*Controlled convection with N2 option. *1-profile system. *More than 2 m process length. *Multijet air flow technology for excellent zone separation. *Volumetric and temperature controlled heat transfer *Highly stable temperature environment *C
Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
