New Equipment | Rework & Repair Equipment
The AT-GDP Series BGA Rework Systems are semi-automatic machines featuring the latest vision and process control technologies. Lead-Free applications consisting of complex components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s are rework
Mechatronika MR10 is a fully programmable far infra red oven, suitable for reflow soldering as well as glue heat drying. Soldering sections are controlled by a microprocessor, that also enables the storage of up to sixteen parametrized temperature
Conveyor reflow oven with 50" (1270mm) long heating tunnel for low to medium volume surface mount assembly. Four (4) heating zone reflow oven with 18" (457mm) wide conveyor for production runs utilizing our patented Horizontal Convection Heating te
The RS Ovens Efficient power design and air management system greatly improves energy savings while lowering carbon emissions. Independent Air Velocity Controlling System Independent Air Velocity Controlling System allows for flexible processing co
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
New Equipment | Assembly Services
WORK BOARD HOLDERS TOOLING TO HOLD PRINTED CIRCUIT BOARD IN PLACE OVER INSERTION & PICK AND PLACE MACHINE SELECTIVE SOLDER PALLETS TO ELIMINATE MANUAL MASKING OF PRINTED CIRCUIT BOARD'S BEFOR THEY GO OVER WAVE. PALLETS HELP WITH DEFECTS AND E
*Controlled convection with N2 option. *1-profile system. *More than 2 m process length. *Multijet air flow technology for excellent zone separation. *Volumetric and temperature controlled heat transfer *Highly stable temperature environment *C
*Controlled convection with N2 option. *1-profile system. *More than 2 m process length. *Multijet air flow technology for excellent zone separation. *Volumetric and temperature controlled heat transfer *Highly stable temperature environment *C
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards are t
