Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Solder Paste Stencils
DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
SUPERIOR VISION 4000 � SUPERIOR SOLDER DEFECT DETECTION The Photon Dynamics Superior Vision (SV) 4000 AOI system delivers comprehensive defect detection. Designed for high-pulse production of large-format, high-density and small component PWAs, t
SUPERIOR VISION 6000 � UNRIVALED SOLDER DEFECT DETECTION The Photon Dynamics Superior Vision (SV) 6000 AOI system delivers comprehensive defect detection. Designed for high-pulse production of large-format, high-density and small component PWAs,
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