New Equipment | Cleaning Agents
IONOX® BC is a general purpose semi-aqueous solvent blend specially designed for effective removal of flux residues and dried uncured adhesives. IONOX® BC is approved for manual stencil cleaning as well as underscreen wipe applications. Manufactur
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Solder Paste Stencils
ALPHA® Stencil products are based on unique blends of advanced technology, the experience gained from having made over half a million solder paste stencils, the specialist knowledge that could only be accumulated by a company privileged to produce bo
New Equipment | Cleaning Agents
CYBERSOLV® C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. CYBERSOLV® C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes. CYBERS
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