Cut panels without scoreline and with overhanging components. The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs. Singulate panels up to 12" wide. Microprocessor controlled STI safety interlock Long Lasting Di
The FKN Systek S100 is an economical PCB singulating saw for moderate production volumes and laboratory use. The diamond saw blade with the linear bearing positioning table to guide the PCB to be cut, allows for quick and clean singulation of PCB
New Equipment | Cable & Wire Harness Equipment
Overview The SPU 60 Saw & Polishing Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections and others. Excellent cutting surface Sawing & polishing in one working step
High speed depaneling equipment utilizing either router bits or cutting saw blades. IPTE provides in-line function and circuit test equipment meeting your circuit board testing requirements. Contact us regarding a complete line of conveyors meeting y
New Equipment | Cable & Wire Harness Equipment
Overview The SPU 6 Saw & Polishing Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections and others. Very simple handling Efficient and quick cleaning Cleaning directl
New Equipment | Cable & Wire Harness Equipment
Overview The SawInspect System 6 (SIS 6) is an innovative new product that provides crimp quality assurance and quality control to the wire processing industry. This extremely compact sawing and inspection system is used to quickly create and analyz
New Equipment | Cable & Wire Harness Equipment
Overview Schleuniger’s MicroGraph System allows the creation of high-quality crimp cross-sectional images in a fraction of the time needed with “conventional” methods. The system is comprised of modular components that can be combined according to
The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p
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