New SMT Equipment: second limit over (Page 7 of 13)

Fuji XP-243E - Compact Multi-Functional SMT Mounter

Fuji XP-243E - Compact Multi-Functional SMT Mounter

New Equipment | Pick & Place

The XP-243E provides accurate placement of small parts to larger odd-form components in a compact footprint. On-the-fly vision inspection and optical correction ensure the most accurate placements. Fuji's new dual vacuum (V2) nozzle holder performs

Fuji America Corporation

Agilent E4419B EPM Series Dual-Channel Power Meter

Agilent E4419B EPM Series Dual-Channel Power Meter

New Equipment | Test Equipment

The E4419B power meter is designed for bench and automatic test equipment (ATE) use.     True dual-channel power meter - two simultaneous power readings     Fast measurement speed (up to 100 readings per second, over the GPIB, with E-series sensor

Recon Test Equipment Inc.

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

AccuThermo AW 410  Rapid Thermal Processing (RTA/RTP/RTO/RTN)

AccuThermo AW 410 Rapid Thermal Processing (RTA/RTP/RTO/RTN)

New Equipment |  

The AccuThermo AW410 was derived from the AG Associates 610 production-proven design.  Allwin21 Corp. is the exclusive manufacturer of the AG Associates Heatpulse 610 desktop atmospheric RTP (Rapid Thermal Processing) system.  The system uses high in

Allwin21 Corp.

HawkEye®  - High Speed Deposit Verification System

HawkEye® - High Speed Deposit Verification System

New Equipment | Printing

HawkEye is an automatic print verification technology that operates at the line beat rate. The system can be configured to assess 100% of printed boards and gives a rapid go/no-go indication for each, meaning that faulty boards can now be automatical

ASM Assembly Systems (DEK)

Scotle IR360 Pro 2 in 1 Infrared BGA Rework Station

Scotle IR360 Pro 2 in 1 Infrared BGA Rework Station

New Equipment | Rework & Repair Equipment

Scotle IR360 PRO is a 2 in 1 BGA rework station which can be used as infrared BGA rework station and hot air BGA Rework station with three independently temperature zones. Users can use total different BGA rework system only in one BGA rework station

Scotle Technology Group Limited

Toughcam P-Series Infrared Thermal Imaging Camera

Toughcam P-Series Infrared Thermal Imaging Camera

New Equipment | Inspection

Affordable Quality in an easy-to-use, lightweight, Thermal Imaging System The new ToughCam P-series portable thermal imager offers outstanding image quality and radiometric temperature measurement performance in an affordable, rugged and easy to us

Infrared Cameras Inc.

Virtual Panel Tooling

Virtual Panel Tooling

New Equipment | Software

Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate

ASM Assembly Systems (DEK)

Yamaha YCP10 High-Performance Compact Printer

Yamaha YCP10 High-Performance Compact Printer

New Equipment | Printing

The YCP10 is developed as the successor to the YCP II, and offers high-performance printing in a compact body that is also cost effective. It has the versatility to handle large circuit boards, as well as a wide variety of stencil sizes despite its c

Yamaha Motor IM America, Inc.

10KV 2W Laser high voltage power supply

10KV 2W Laser high voltage power supply

New Equipment |  

Product Name MFA Power(W) 0.5W,1W,2W Output Voltage(KV) ,3,4,5,6,7.5,8,9,10, DIMENSIONS: 1KV-10KV:2.50L(63.50L)X1.25W(31.75W)X0.68H(17.34H) APPLICATIONS High voltage testing PMT,MCP,radiation counter Electron Beam/Ion Beam Mass spectrome

Wisman High Voltage Power Supply Co.,LTD.


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Easily dispense fine pitch components with ±25µm positioning accuracy.