New SMT Equipment: setting nozzlle gradient (Page 1 of 1)

Forced Convection Reflow Ovens.

Forced Convection Reflow Ovens.

New Equipment |  

The Fritsch Convection Reflow Soldering System uses recirculated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat

FRITSCH USA, Inc.

V-M.O.L.E.® Compact Reflow Oven Thermal Profiler

V-M.O.L.E.® Compact Reflow Oven Thermal Profiler

New Equipment | Reflow

The V-M.O.L.E.® is a full-featured compact thermal profiler that belies its sophistication in an easy-to-use 3-channel Mini-thermocouple configuration. Ideal for VERIFICATION of PCB profile performance, 3 channels give you Hot, Cold and Sensitive com

Electronic Controls Design Inc. (ECD)

M.O.L.E.® MAP Thermal Profiler Software

M.O.L.E.® MAP Thermal Profiler Software

New Equipment | Software

M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E

Electronic Controls Design Inc. (ECD)

Sherlock - Automated Design Analysis software

Sherlock - Automated Design Analysis software

New Equipment | Software

Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right

DfR Solutions (acquired by ANSYS Inc)

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