DEK NeoHorizon 01ix SMT Stencil Printer Standard cycle time: 6.5 seconds + processMaximum printing surface: 510 mm (X) × 508,5 mm (Y)Weight: Approx. 690 kgDEK HawkEye 1700 digital cameraProduct description: DEK NeoHorizon SMT Stencil Printer, Standa
DEK NeoHorizon 03ix SMT Stencil Printer Standard cycle time： 8 seconds + processMaximum printing surface： 510 mm (X) × 508,5 mm (Y)Weight: Approx. 690 kgDEK HawkEye 750 digital cameraProduct description: DEK NeoHorizon SMT Stencil Printer, Standard
2.0 Cpk @ +/- 12.5µm, (±6 Sigma) * Process Alignment Capability >2.0 Cpk @ +/- 25µm, (±6 Sigma) * Standard cycle time 10 seconds + process Maximum printing surface 508 mm (X) × 508 mm (Y) User interface Touchscreen, keyboard a
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Smt Hitachi nozzles sigma-G4 Sigma-G5 nozzles used in pick and place machine Hitachi GXH-1, GXH-3 Nozzles Part Number Description 630 128 4842 (#101) HA01 0.7x0.4/ø0.25 (for 0603) 630 132 2322 (#111) PV01 1.1x0.6/ø0.38 (for
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
High Performance Print SPI Born By Samsung's Advanced SMT Technology. Provides high print quality of 6 sigma level. Alignment Accuracy : ±12.5μm@6σ Print Cycle Time : 5seconds (Excluding printing time) Applicable PCB (LxW) : 330mm x 250mm Sten
New Equipment | Test Equipment - Bond Testers
A bond tester that can grow with your company. Future proof performance and flexibility. With the Condor Sigma Lite, XYZTEC gives you a low cost entry point without sacrificing performance to meet future demands. The Condor Sigma Lite is upgradeable
Job Purpose Develop the next generation, leading edge products for GE Energy customers. As an Advanced Manufacturing Engineer supporting Gas Turbines, you will: Work in a highly cross-functional environment with Engineering, Manufacturing, Sourcing
New Equipment | Test Equipment - Bond Testers
The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Full automation, 0.075% accuracy, best ergonomics, highest throughput, vision options,
New Equipment | Test Equipment - Bond Testers
Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages av
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