When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
Hanwha Decan S2 SMT Assembly line Decan S2 SMT Assembly Line Decan S2 SMT Assembly Line SMT PCB production Full Automatic Assembly line Speed:158000CPH Product description: Hanwha Decan S2 SMT Assembly line, Speed 158000CPH INQUIRY Ha
New Equipment | Solder Paste Stencils
Flip Up SMT Rework Stencils are laser cut solder paste stencils designed to replicate the intial manufacturing process albeit for a designated component or selected area. These laser cut mini stencils can either have flaps (to prevent neighboring are
TP300 is the simplest solution, the most compact-size and lowest-cost solder paste printer, it can be easy and accurate to print the solder paste on any board. Please see details below: 1). It is suitable for both single-sided and double-sided p
S&M Automation Ltd is one of the biggest and most professional SMT machine manufacturer in China. Our products line includes Reflow Oven, Wave Soldering Machine, PCB Handling Conveyor, Printer, Solder Paste Mixer and etc. We have over 18 years of exp
New Equipment | Solder Materials
8 hrs. @ 30–45% RH & 22–25°C ~6 hrs. @ 45–70% RH & 22–25°C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Proce
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
The MK-838 is used for efficient and flexible high yield wafer bumping as well as hybrid applications. Shown with Pressure Chamber for superior paste release and automatic substrate handling.
