New SMT Equipment: solder ball ipc-610 (Page 1 of 8)

PCB Rework, PCB Repair Services

PCB Rework, PCB Repair Services

New Equipment | Rework & Repair Services

On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and  product  research and developers.  Specializing in quick turn around times to help get your product to market on time. Training Serv

Precision PCB Services, Inc

Reballing Preforms-EZReball™

Reballing Preforms-EZReball™

New Equipment | Rework & Repair Equipment

The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o

BEST Inc.

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

Thru-hole Assembly

Thru-hole Assembly

New Equipment | Assembly Services

Rest assured in the quality of your production runs with Accu-sembly's IPC-610D certified hand solderers and inspectors, and electrostatic discharge (ESD) protected assembly floor. Our Thru-hole assembly process allows for your parts to be hand prepp

Accu-sembly, Inc.

PCB PCBA

PCB PCBA

New Equipment |  

PCBA(RoHS-Compliance,Lead free,ODM,OEM,SMT,EMS) We supply OEM and ODM services for PCBA. 1) Surface-mounting Technology (SMT) and Through-hole/DIP 2) 0402,0201 placement 3) BGA,CSP,QFP 4) IC precision: 0.3mm 5) AOI,X-Ray,ICT(In circuit test),FC

Tronixlink PCB PCBA

Low Melting Type BGA Solder Ball

New Equipment |  

Sn-Zn-Al, Sn-Zn-3Bi, Features; Luster/Strong Joint, Melting Temp. 199C, �80-760�m

CCT Europe BV

High Temperature Type BGA Solder Ball

New Equipment |  

Sn-Ag-Cu, Sn-Cu, Features; for High Temp Application, Melting Temp. 220-227C, �80-760�m

CCT Europe BV

eBall Lead-Free Solder Spheres

eBall Lead-Free Solder Spheres

New Equipment | Solder Materials

High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch

Nihon Superior Co., Ltd.

Component Testing & Verification

New Equipment | Test Equipment

Vigilant provides an array of component testing and verification services. Not only do we test and verify all electronic components we source, but we can also provide a full component test and  verification service for components our customers have p

Vigilant Components

VANTAGE S22 PLUS - AOI System

VANTAGE S22 PLUS - AOI System

New Equipment | Inspection

Vantage™ S22 Plus is a cost-effective solution that delivers top-of-the-line AOI performance to help you achieve outstanding operational efficiency and high first-pass yield in even the most demanding SMT / PTH environments. DPIX™ 3-D Technology

Orpro Vision GmbH

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