Wide variety of styles including Peel-A-Way� low profile removable carrier, high density molded connectors, and more. Patented features such as solder preforms and screw-machined terminals offer high reliability.
Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
The need for automatic optical inspection (AOI) in the SMT assembly industry is clear. Increasing miniaturisation and placement densities mean that only an AOI system can reliably detect all types of solder defects at line speeds and at a reasonable
New Equipment | Solder Materials
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch
SOLDERITE ULF-210RN, ULF-210RNI, ULF-250, ULF-300VZ-3, and ULF-500VS are ultra low residue type flux and these are developed for soldering printed circuit board mounted chip componenets and flat ICs which are for miniaturize and high density purpose.
New Equipment | Rework & Repair Equipment
FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allo
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
The YCP10 is developed as the successor to the YCP II, and offers high-performance printing in a compact body that is also cost effective. It has the versatility to handle large circuit boards, as well as a wide variety of stencil sizes despite its c
PCBA(RoHS-Compliance,Lead free,ODM,OEM,SMT,EMS) We supply OEM and ODM services for PCBA. 1) Surface-mounting Technology (SMT) and Through-hole/DIP 2) 0402,0201 placement 3) BGA,CSP,QFP 4) IC precision: 0.3mm 5) AOI,X-Ray,ICT(In circuit test),FC
