New SMT Equipment: solder flow (Page 1 of 7)

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Semi-Automatic SMT Production Lines

Semi-Automatic SMT Production Lines

New Equipment | Assembly Services

PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Electromagnetic pump

Electromagnetic pump

New Equipment |  

Solder flow by electromagnetic. It flow evenness steadily, almost non-oxidation. Titanium alloy solder bath: suitable for lead-free solder. Adopted the strengthen soakage spout can greatly reduce the SMT element soldering defect. Motorized mechan

SMT SOURCE

High reliability Copper Clad Laminate

High reliability Copper Clad Laminate

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

Thin Core Copper Clad Laminate FR4 & Prepreg

Thin Core Copper Clad Laminate FR4 & Prepreg

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

Solder-Saver

Solder-Saver

New Equipment | Solder Materials

The Solder-Saver, from Aprotec: offers the opportunity to instantly recyle dross created in the solder pot. Hot dross is scooped up from the surface of the wave solder pot by the hand held, lightweight Solder-Saver. The unit separates dross oxides

Ascentech LLC

GW-10A-HT Soldering Fountain with Blow-Thru Air Nozzle

GW-10A-HT Soldering Fountain with Blow-Thru Air Nozzle

New Equipment | Wave Soldering

High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards.  Microprocessor based digital controller that regulates solder temperature

DDM Novastar Inc

GW-10-HT Soldering Fountain

GW-10-HT Soldering Fountain

New Equipment | Wave Soldering

High temperature, lead-free Soldering Fountain used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards.   Microprocessor based digital controller that regulates solder temperature, wave height, and sold

DDM Novastar Inc

Manufacturing

Manufacturing

New Equipment |  

AB Electronic Assemblies Ltd (ABEA)'s manufacturing capability is complemented by our partnership approach in providing comprehensive manufacturing and support services for OEM's to optimise products' speed to market. As a result of continuous inves

AB Electronic Assemblies

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Voidless Reflow Soldering

High Throughput Reflow Oven
Void Free Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications


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