New SMT Equipment: solder joint (Page 5 of 18)

SVX-2000

New Equipment |  

SUPERIOR VISION & X-RAY 2000 Advanced Inspection of Your Printed Wiring Assemblies (PWA) Including Ball Grid Array (BGA) and Other Hidden Features Photon Dynamics Superior Vision & X-ray (SVX) 2000 completely inspects PWAs inside and out. Using adv

Photon Dynamics (Acquired by KLA Corporation)

5K - Large Board High-Speed 3D AOI

5K - Large Board High-Speed 3D AOI

New Equipment | Inspection

The large board solution The 5K Series offers flexibility for wider board applications and benefits from all the latest Vi TECHNOLOGY® innovations, including Selective 3D AOI technology for accurate tilt and coplanarity measurement of ICs, connector

Vi TECHNOLOGY

9K - Heavy, Extra Large PCB AOI

9K - Heavy, Extra Large PCB AOI

New Equipment | Inspection

Heavy Board Solution The 9K Heavy Board AOI is an inspection and process control solution dedicated to heavy PCBAs up to 15 kg and 21” x 24”. The 9K HB AOI has been designed with best-in-class hardware and software technologies to provide highest p

Vi TECHNOLOGY

QX600™ Ultra-Fast, Ultra-Versatile AOI

QX600™ Ultra-Fast, Ultra-Versatile AOI

New Equipment | Inspection

The QX600™ is designed with an all-new SIM (Strobed Inspection Module) with enhanced illumination – delivering the best 01005 and solder joint inspection performance ever. With a higher sensor resolution (12 µm), you get to see crisp, perfect qualit

CyberOptics Corporation

X2 Automatic In-Line X-RAY Inspection / Transmission & 3D-SFT

X2 Automatic In-Line X-RAY Inspection / Transmission & 3D-SFT

New Equipment | Inspection

Automatic high-speed in-line inspection system for electronic devices and assemblies. Featuring transmission x-ray technology, intelligent handling system for fast loading/unloading as well as MIPS software solutions for inspection of single-sided an

MatriX Technologies GmbH

MVP Selecta - Bottom-Side Selective Solder AOI

MVP Selecta - Bottom-Side Selective Solder AOI

New Equipment | Inspection

The MVP Selecta is a new product designed to complement your selective solder system and allows you to inspect the components soldered by your bottom-side soldering solution. MVP’s Selecta allows for full bottom-side inspection of all wave and reflow

Machine Vision Products, Inc

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

New Equipment | Solder Materials

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC

AIM Solder

GenX series X-ray Inspection Sytems

GenX series X-ray Inspection Sytems

New Equipment | Inspection

GenX Series X-ray Inspection Systems The new GenX series x-ray inspection systems come in three model choices corresponding to the power level of their specific x-ray source and can be configured with various detectors to provide a wide range of hi

Pacific X-ray Imaging

MR10 Reflow Ovens

MR10 Reflow Ovens

New Equipment | Reflow

Mechatronika MR10 is a fully programmable far infra red oven, suitable for reflow soldering as well as glue heat drying. Soldering sections are controlled by a microprocessor, that also enables the storage of up to sixteen parametrized temperature

Mechatronika

VT-X750 In-Line Automated X-Ray CT Inspection

VT-X750 In-Line Automated X-Ray CT Inspection

New Equipment | Inspection

High-speed Automated X-ray CT Inspection System The Omron VT-X750 is the perfect solution to manufacturers desiring the highest-speed, in-line, automated 3DCT X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joi

Omron Inspection Systems


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