New SMT Equipment: solder joint cracked (Page 2 of 19)

Lead Free Desktop Infrared  Reflow Oven 1816

Lead Free Desktop Infrared Reflow Oven 1816

New Equipment | Reflow

The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the

HuiKe Tech

Desktop Reflow Oven R3028

Desktop Reflow Oven R3028

New Equipment | Reflow

Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe

HuiKe Tech

DRM-SMT-F Surface Mount Solder Joint Evaluation Training & Reference Guide

DRM-SMT-F Surface Mount Solder Joint Evaluation Training & Reference Guide

New Equipment | Education/Training

Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. With 44 pages and a compact 5.5 x 8.5 inch (14 x

soldertools.net

SMT 256EP Solder Joint Encapsulant Paste

SMT 256EP Solder Joint Encapsulant Paste

New Equipment | Materials

SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and

YINCAE Advanced Materials, LLC.

BP 256 Ball Attach Adhesive

BP 256 Ball Attach Adhesive

New Equipment | Materials

BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During

YINCAE Advanced Materials, LLC.

DRM-PTH-F Through-Hole SolderJoint Evaluation Training & Reference Guide

DRM-PTH-F Through-Hole SolderJoint Evaluation Training & Reference Guide

New Equipment | Education/Training

Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections. With 30 pages and a compact size at 5.5 x 8.5 inch

soldertools.net

S3016 - Bottom-Up AOI

S3016 - Bottom-Up AOI

New Equipment | Inspection

Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed

Viscom AG

NS Lead Solder

NS Lead Solder

New Equipment | Solder Materials

A rich and line-up of solders possessed of various characteristics and properties. NSH63V forms a strong join and displays excellent resistance to heat cycle stress, thus prolonging the working life of various electrical devices. This solder has

Nihon Superior Co., Ltd.

Kapp 509 - Cadmium Zinc Multipurpose Solder

Kapp 509 - Cadmium Zinc Multipurpose Solder

New Equipment | Solder Materials

Cadmium-Zinc solders are medium temperature alloys that provide strong, corrosion- resistant joints on most metals. The eutectic solder is the industry standard, Kapp 509. It melts and solidifies at 509°F and 265°C, making it an ideal solder for oven

Kapp Alloy & Wire, Inc

Kapp Antimonial Tin - Lead Free Solder for Electrical or Electronic Connections

Kapp Antimonial Tin - Lead Free Solder for Electrical or Electronic Connections

New Equipment | Solder Materials

95% Tin / 5% Antimony a.k.a. "Antimonial Tin" is a Lead solder replacement for soldering electrical equipment, Copper tubing, and cooling coils for refrigerators. Joints are of moderate strength where the higher strength and higher cost of KappZapp™

Kapp Alloy & Wire, Inc


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