Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability
Layer: 1L Base Material:CEM-1 CTI600 Board Thickness: 1.6mm Final copper: 35um Surface Finish: HAL lead free Solder mask: Matt Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test,
New Equipment | Test Equipment
Auto-SIR – Performs Surface Insulation Resistance testing in accordance with all major international standards: IEC 61189-5, ISO 9455-17, IPC-TM-650, BELCORE GR-78-CORE, DIN German & JIS Japanese standards. Includes elements of ANSI/IPC-JSTD001C (as
Dual Lane Screen Printing. The SPD (screen printer dual) features high-speed simultaneous production of two boards of the same type or two completely different products. Non-stop model changeover capability allows changeover of one stencil while th
New Equipment | Board Handling - Pallets,Carriers,Fixtures
With MB Manufacturing’s continuous improvement strategy we have developed the ultimate selective solder fixture out of a combination of titanium and composite, incorporating the latest in flow technologies to eliminate skips and bridges on a selectiv
1). Size: 45*140mm/1 up 2). Layer count: 2 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/space 7). Pads finish: HASL 8).
EMC Global Technologies At EMC Global Technologies we manufacture fixtures and tooling for the processing of printed circuit board assemblies. FIXTURES Wave Solder Pallets Dedicated or Adjustabl
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Stentech has advanced capabilities in machining and drilling composite materials. Stentech can provide a wide range of manufacturing solutions for wave solder pallets that are custom-engineered and manufactured to each client's specifications. The u
New Equipment | Selective Soldering
A new entry point in cost-effective, easy-to-operate, automatic batch selective soldering. ESS310 and ESS500 Selective Soldering Machines provide easy to operate, robust systems for batch processing of mixed technology boards that require selective
The unique electrical, thermal and mechanical properties of aluminum combined with Polyonics proven coating, adhesive and manufacturing technologies provide high quality tape material ideal for high temperature applications. In particular, Polyonics
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