The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V
The SMT 8200SPI and 8200CPI are laser-based inspection systems. The 8200 meets the most demanding cycle time requirements with 100% inspection of solder paste or component placement. Using a 3D scanning laser, the 8200 can detect solder paste volum
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Trade names: Ricocel Similar Wave Solder Pallet Material, Carbon Fiber Glass Reinforced Sheet Available Shapes: Sheet Color: Black Sheets Thickness: 3mm ~ 80mm Size: 1010×1010mm, 1210×1010mm About Ricocel Similar Wave Solder Pallet Material: It is
New Equipment | Solder Paste Stencils
Step-up / Step-down Stencil. The patented step stencil from LaserJob, called PatchWork® - stencil, was developed to print in one printing step different paste deposit heights. Due to the multiplicity of different component leads on one printed circu
New Equipment | Tape and Reel Equipment
ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment. The preform is placed directly into the solder paste prior to assembly reflow. Alpha So
New Equipment | Cleaning Equipment
The Low-cost / Compact Stencil Cleaners Heated wash for cleaning lead-free solder paste, pallets and adhesives 100% Stainless steel construction Two model sizes to conserve energy, use less chemistry and generate less waste Install i
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
New Equipment | Solder Materials
8 hours in controlled environment) Prints consistently at a wide range of speeds Wide reflow process window for profiling Excellent wetting on a variety of surface finishes Maintains tack over time Suitable for SnPb eutectic alloys as well
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
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