New Equipment | Solder Materials
An easy-to-use cost-effective solution for producing professionally masked PCBs in an in-house prototyping environment. Compact, quick and easy to use Professional finish and perfect soldering Four simple steps to a professional result
New Equipment | Solder Materials
Advanced Metals Technology Inc. (AMT) is the world leader in manufacturing electronic grade solder powders. Our proprietary separation process allows us to produce perfectly sized, low oxide solder powders and spheres for BGAs, while maintaining low
Tamura's Solder Paste RMA Series is a solder paste, which consists of RMA type flux satifies QQ-S-571E and spherical solder powder with very little oxide. So flux residue after soldering becomes high reliable coating with excellent insulation resist
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
New Equipment | Solder Materials
The Solder-Saver, from Aprotec: offers the opportunity to instantly recyle dross created in the solder pot. Hot dross is scooped up from the surface of the wave solder pot by the hand held, lightweight Solder-Saver. The unit separates dross oxides
New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
Polyimide masking discs have 1.2~1.5 mil of silicon adhesive which does not leave any residue. It can withstand temperature up to 280℃. Applications: Electrical Insulation, Gold leaf mask of printed circuit boards during wave soldering, transformer
New Equipment | Cleaning Agents
CYBERSOLV® C8622 is a full strength solvent blend specifically designed as an IPA alternative in stencil wiping and manual bench top cleaning applications. Easy to use, C8622 is applied in applications where IPA is typically used. Safe IPA Alterna
New Equipment | Solder Materials
Made for high speed leaded assembly. No Clean Solder Paste, Alloy: Sn63/Pb37, Type 3 Powder -325+500, 250 gram jar. Buy one or two jars on line. While supplies last.
