New SMT Equipment: solder voids increasing (Page 1 of 24)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

SMT Dispensing Pumps for Integration

SMT Dispensing Pumps for Integration

New Equipment | Dispensing

Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti

GPD Global

Heller 2043 MK7 SMT Reflow Oven

Heller 2043 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2043 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width: 50 - 560 mmWeight: 3400 kgDimension: W7224 x D1520 x H1440 mmProduct description: Heller 2043 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width: 50 - 560 mm,

Qersa Technology Co.,ltd

ZM-R7850A Nitrogen Capable BGA Rework Station

ZM-R7850A Nitrogen Capable BGA Rework Station

New Equipment | Rework & Repair Equipment

The Zhuomao ZM-R7850A BGA Rework Station is a top of the line Nitrogen Capable Rework System.  Great to help increase yield with Lead Free Solders and a no clean process.   Place SMD components from .8mm to 80mm with the high resolution motorized vis

Precision PCB Services, Inc

Siemens 12mm 16mm original feeder 00141092

Siemens 12mm 16mm original feeder 00141092

New Equipment | Components

http://www.flason-smt.com/product/Siemens-12mm-16mm-original-feeder-00141092.html Siemens 12mm 16mm original feeder 00141092 SMT Spare Parts Seimens feeder Siemens 12mm 16mm original feeder 00141092 Usage: Seimens pick and place machine Produ

Flason Electronic Co.,limited

BGA Rework Machine for soldering and desoldering.  Hot Air BGA rework station for printed circuit board repair.

BGA Rework Machine for soldering and desoldering. Hot Air BGA rework station for printed circuit board repair.

New Equipment | Rework & Repair Equipment

BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla

Precision PCB Services, Inc

Ersa HOTFLOW 3/20 SMT Reflow Oven

Ersa HOTFLOW 3/20 SMT Reflow Oven

New Equipment | Reflow

Ersa HOTFLOW 3/20 SMT Reflow Oven Working width: 45-580 mmProcess length: 5,190 mmHeated length: 3,700 mmCooling length: 1,490 mmWeight appr. 3,200 kgDimension: 6,590x1,530x1,450 mm   Ersa HOTFLOW 3/20 SMT Reflow Oven Ersa HOTFLOW 3/20 SMT Refl

Qersa Technology Co.,ltd

Hanwha SM481 Plus SMT Assembly Line

Hanwha SM481 Plus SMT Assembly Line

New Equipment | Test Equipment

Hanwha SM481 Plus SMT Assembly Line Hanwha SM481 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:40000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach

Qersa Technology Co.,ltd

Hanwha DECAN S1 SMT Assembly Line

Hanwha DECAN S1 SMT Assembly Line

New Equipment | Assembly Services

Hanwha DECAN S1 SMT Assembly Line Hanwha DECAN S1 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 47000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pl

Qersa Technology Co.,ltd

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

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