The LaserVision Mini SP3D system combines laser measurement accuracy with Automatic Data Collection (ADC) for real-time control of the SMT stencil printing process. With its Windows® 7+ Pro OS and service free USB interface, the Mini SP3D system is e
Automated Benchtop 3D Measurement & Analysis. VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and
High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3
Exceptional repeatability and print accuracy FLEXIBILITY - SP700AVi platforms address the critical demands of fast set up and product changeover through flexible automation strategies that streamline assembly throughput. AUTOMATION - Features inc
New Equipment | Cable & Wire Harness Equipment
Overview Microscope for visual analysis of cross-sectional images of crimped connections. Precise results in real-time Simple connection and installation with standard PC Clear illumination with LED ring light Analysis according to
The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS. Packaged in a rugged, bench top platform designed for show, engineered for the most advanced measurement requirements found withi
i-DR A252 configured with the most complete, and advanced features among the series to support today’s various dispensing markets and applications. This series with NDisp3WIN software is ideally for high volume production applications that need
VisionPro APXT incorporates the sophisticated 3D measurement technology found in ASC International's VisionPro AP500 systems in a production-ready positioning and fixturing system capable of handling double-sided SMT assemblies as large as 18" x 22"
Specification： 1、 Theoretical speed：22000/h，actual working speed:12500/h 2、 Non-perform rate：less than 300PPM 3、 Inserting direction：horizontal 0°to 360° 4、 Component density：high density 5、 PCB size：min.50mm*50mm，max.450mm*450mm 6、 PCB thickness
Theoretical speed：22000/h，actual working speed:12500/h Pitch: 2.5, 5.0, 7.5 (sizes can be customized) Non-perform rate: less than 300PPM Inserting direction:-90 to +90 Component density：high density PCB size：min.50mm*50mm，max.450mm*450mm PCB th
