New SMT Equipment: spi excessive error (Page 1 of 3)

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

Koh Young KY8030-3 3D Inline SPI

Koh Young KY8030-3 3D Inline SPI

New Equipment | Test Equipment

Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:

Qersa Technology Co.,ltd

ScanINSPECT SPI - Solder Paste Inspection Station

ScanINSPECT SPI - Solder Paste Inspection Station

New Equipment | Inspection

ScanINSPECT SPI provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT SPI uses a simple Windows user interface integrated with an automatic conveyo

ScanCAD International, Inc.

DSPI - Serial Peripheral Interface Master/Slave

New Equipment | Other

Overview The DSPI is a fully configurable SPI master/slave device, which allows user to configure polarity and phase of serial clock signal SCK. It allows the microcontroller to communicate with serial peripheral devices. It is also capable of inte

Digital Core Design

VisionPro AP500 - Automated 3D SPI

VisionPro AP500 - Automated 3D SPI

New Equipment | Inspection

Automated Benchtop 3D Measurement & Analysis. VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and

ASC International

DSPI_FIFO - Serial Peripheral Interface with FIFO - Master/Slave

New Equipment | Other

Overview The DSPI_FIFO is a fully configurable SPI master/slave device, which allows user to configure polarity and phase of serial clock signal SCK. It allows the microcontroller to communicate with serial peripheral devices. It is also capable of

Digital Core Design

Kapp Eco-Babbitt Spray Wire for Capacitors

Kapp Eco-Babbitt Spray Wire for Capacitors

New Equipment | Solder Materials

Kapp Eco-Babbitt coatings are applied to capacitors as a protective coating; • To shield against electromotive force (EMF) and electromagnetic interference (EMI) with the specified performance of the capacitor; • To prevent current and charge leaka

Kapp Alloy & Wire, Inc

VisionPro HSi High Speed Offline 3D SPI

VisionPro HSi High Speed Offline 3D SPI

New Equipment | Inspection

VisionPro HSi is high speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a

ASC International

VisionPro AP212 3D SPI

VisionPro AP212 3D SPI

New Equipment | Inspection

VisionPro AP212 is a sophisticated 3D solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes training, an op

ASC International

3D XPI 5000L - In-Line SPI System

3D XPI 5000L - In-Line SPI System

New Equipment | Inspection

Technical Innovation The first 10 bit image processing in its industry by on-the-fly vibrationless scan (High speed & high precision image acquisition) 4 times higher height measurement resolution than the existing Moire technology (The best

Synapse Imaging Co., Ltd.

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