New Equipment | Solder Paste Stencils
Full automation solder paste screen stencil printers for led tube light PCB solutions CL-1200,1500 Ideal for LED strip production. CL1200 provides fast, high-precision printing LED panels and other applications. Fully automatic production transpo
New Equipment | Solder Paste Stencils
LaserJob has been manufacturing laser cut SMD stencils for last 20 years. In strained condition with a cutting opening of 20µm an aperture size accuracy of ±3µm and an aperture positioning accuracy of ±10µm is guaranteed for SMD - stencils. All laser
New Equipment | Solder Paste Stencils
Laser cut stainless steel stencil with nano coating from LaserJob. The patented NanoWork - stencil from LaserJob is based on a laser cut SMD stencil. Since 2007 LaserJob coates SMD - stencils and step stencils in an in-house process. The NanoWork co
Straight Fin BGA Heat Sink (High Aspect Ratio Ext.) High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduc
New Equipment | Solder Paste Stencils
DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num
Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil technologies on the market
Slant Fin BGA Heat Sink (High Aspect Ratio Ext.) Features a low profile, slant fin array that offers many of the performance benefits of maxiFLOW™ at a great value Fabricated from extruded aluminum, which minimizes thermal resistance from th
BGA Heat Sink (High Aspect Ratio Ext.) High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance fro
ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p
New Equipment | Solder Paste Stencils
Laser Fab, NiPlate™, NanoCoat™. NicAlloy-XT™ stencils are the premier laser-cut stencils in the industry. Beginning life as a laser-cut stencil, followed by a secondary process utilizing Photo Stencil’s own proprietary NiPlate™ technology, which fur
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