High-density interconnection/HDI PCB Layer: 8 (HDI) Structure: 2+4+2 with stack via Material: FR4(Tg170) Thiness: 1.0mm Surface treatment: Selective immersion gold + OSP Blind via L1-2 & L2-3 & L6-7 & L7-8: 0.1MM (4mil) Buried via L3-6:
New Equipment | Assembly Services
Integrating your design into our processes is a critical element of producing a quality product. Our project managers and engineering teams are well trained to review and verify gerber data for accuracy based on customer design specifications. With m
The next generation of in-house prototyping Laser-based PCB production can achieve much greater circuit detail, and lasers structure circuits significantly faster. This technology provides true on-demand production solution for both prototyping and
New Equipment | Test Equipment
The SME03 is a favorably priced signal generator for applications in the 5 kHz to 3 GHz frequency range. The SME supplies the complex signals required for the development and testing of digital mobile radio receivers. It is capable of generating al
Specifications: Features: As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and ty
Specifications: Features As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and typ
Specifications: Features As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and typ
Technip has pioneered the development of critical products that have permitted the emergence of new concepts in offshore field development. With almost 75% of the market, Technip is the world leader in the design and manufacturing of flexible pipe.
