New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Tacki Pak is a new CCI component handling innovation that allows you to safely and cleanly handle components in a non-slip static safe plastic case or tray. In the past products have been on the market that featured a gel surface in a conductive box.
Long stencil life, Excellent Printing, Minimum slump, High surface insulation resistance, Long tack life.
New Equipment | Solder Materials
SPA1000 – Solder Paste Analyzer ( slump, tack, wetting, solder ball, spread), all-in-one test.
Removing contamination to increase yields, improve process efficiency and save money! Perfect for cleaning PCB's, work surfaces,films, roll edges before unwind, glass etc. *Fitted mechanical bearings *Available in 6� or 12� sizes *Soft-grip handles
Materials: Backing: flat back paper Adhesive: rubber Thickness: 0.13mm Adhesion: 7N/in Ball tack (No.#14): 10 Holding power: 72hrs Tensile strength: 150N/in Elongation: 1% Applications: widely used in masking of diode belting Features: Ada
Specification: Backing: Kraft paper Adhesive: rubber Length: 200/500mm Thickness: 0.11mm Adhesion: 4N/in Tensile strength: 130N/in Features: Low initial tack Self-sticky can get good adhesion Made of crepe and Kraft paper of good masking e
New Equipment | Coating Materials
Conformal coatings for printed circuit boards cure tack free in seconds upon exposure to UV/Visible eliminating the time-consuming steps of traditional thermal-cure and room-temperature-cure conformal coatings. Coatings are available for tin whisker
New Equipment | Solder Materials
NC217 Gel Flux is designed for touch-up and repair work where the flux may spread away from the heat source. NC217 Gel Flux is electrically safe even without a thermal profile. This gel flux dries within one hour of use with or without heat and is t
New Equipment | Solder Materials
8 hours in controlled environment) Prints consistently at a wide range of speeds Wide reflow process window for profiling Excellent wetting on a variety of surface finishes Maintains tack over time Suitable for SnPb eutectic alloys as well
