Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
New Equipment | Test Equipment
The TS Controller is a new control platform for Sigma Systems’ cryogenically and mechanically cooled thermal chambers and plates. Testing of components, sensors, and PCBs typically involves temperature cycling from two to four points, which can be ti
New Equipment | Education/Training
PCM Thermal Solutions/Thermal Engineering provides thermal engineering consulting and R&D design and development services on all areas of thermal engineering. If your project involves fluids, heat or mass transfer and their interactions with any engi
We have various euipment avilable: Re-flow ovens Tape & Reel Inpsection Test Marking Probers Ovens - Burn-in, Temp Cycle, Thermal Shock, Humidity and temp.
New Equipment | Test Equipment
Clover Electronics has extensive test capabilities including, in-circuit, flyinig probe, customer supplied ATE, custom designed models, and thermal cycling. Give us a call and we can meet all of your testing needs.
Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating mo
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
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