New SMT Equipment: tin psr damage (Page 1 of 1)

KappAloy15 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

KappAloy15 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

New Equipment | Solder Materials

KappAloy15™ - 85%Sn - 15%Zn – has a wider plastic range of 390°F - 500°F (199°C - 260°C). This makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools. KappAloy™ Tin-Zinc solder is designe

Kapp Alloy & Wire, Inc

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

New Equipment | Solder Materials

KappAloy9™ - 91%Sn - 9%Zn - 390°F (199°C) eutectic alloy is the best solder for soldering Aluminum wire to Copper busses or soldering Copper wire to Aluminum busses or contacts. Its low eutectic melting point minimizes heating of critical electrical/

Kapp Alloy & Wire, Inc

KappAloy20 - Tin Zinc Spraywire for Capacitors

KappAloy20 - Tin Zinc Spraywire for Capacitors

New Equipment | Solder Materials

KappAloy20™ - 80%Sn - 20%Zn  For soldering of Aluminum to Aluminum and Aluminum to Copper. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15

Kapp Alloy & Wire, Inc

Desktop Reflow Oven R3028

Desktop Reflow Oven R3028

New Equipment | Reflow

Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe

HuiKe Tech

Desktop Reflow Oven R1825

Desktop Reflow Oven R1825

New Equipment | Reflow

This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control

HuiKe Tech

Lead Free Desktop Infrared  Reflow Oven 1816

Lead Free Desktop Infrared Reflow Oven 1816

New Equipment | Reflow

The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the

HuiKe Tech

Titanium material for PCB wave soldering pallet

Titanium material for PCB wave soldering pallet

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Titanium material sheet for PCB wave soldering pallet Model: TA1 Thickness: 1-12mm Sheet size: can be customized  Wall thickness less than 0.5mm Component spacing less than 0.5mm Properties of Titanium material: Titanium is a new type of metal with

Kete Plastics CO.,LTD

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High Throughput Reflow Oven

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