New SMT Equipment: tray 3d (Page 1 of 1)

Hanwha XM520 SMT Assembly Line

Hanwha XM520 SMT Assembly Line

New Equipment | Assembly Services

Hanwha XM520 SMT Assembly Line Hanwha XM520 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 100000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place m

Qersa Technology Co.,ltd

Panasonic BM Series PCB Placement Equipment

Panasonic BM Series PCB Placement Equipment

New Equipment | Pick & Place

General purpose placement with tape, tray and stick inputs. 30,000 cph. 120-160 8mm reels. A wide range of component, quick changeover capabilities Ensures continuous productivity by placing components from (01005”) 0402* to L 55 mm × W 55 mm or

Panasonic Factory Solutions Company of America (PFSA)

Europlacer IICO with integrated intelligence

Europlacer IICO with integrated intelligence

New Equipment | Pick & Place

198 feeder capacity 9100 CPH Full spectrum component placement, from 0201 to 50mm x 50mm 8 spindle rotary turret with optical sensors, 3D, and  BGA lighting/inspection Internal matrix trays with no intrusion 40 position "smart" nozzle tool

4 Tech Electronics Inc.

PSV7000 - Automated Programming System

PSV7000 - Automated Programming System

New Equipment | Component Programming

World's premier automated programming system with the speed, flexibility, small parts handling & fast changeover to support complex jobs at 50% lower costs. Velocity:  Engineered for speed and accuracy, the PSV7000 gives you blazing fast throughput

Data I/O Corporation

Ultra 850XB BGA and Packaging AOI

Ultra 850XB BGA and Packaging AOI

New Equipment | Inspection

Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def

Machine Vision Products, Inc

850G Die Placement AOI

850G Die Placement AOI

New Equipment | Inspection

Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu

Machine Vision Products, Inc

1C31194G01

1C31194G01

New Equipment |  

1661D89G01 Power Supply MMI P/S (old version) w/ AC/DC RT301-2 brick and 3MSC7 7380A31G01 card 115VAC 2 1661D89G02 Power Supply MMI P/S (old version) w/ AC/DC RT301-2 brick and 3MSC7 7380A31G01 card 230VAC 2 1661D89G03 Power Supply MMI P/S (old versi

Zhengzhou Weilin Electronic Technology Co.,ltd

Westinghouse CARDS 1661D89G01 Power Supply

Westinghouse CARDS 1661D89G01 Power Supply

New Equipment | Components

1A54252G02 1A54289G06 1A57252G02 1A57288G06  1B30016H06 1B30023H01 1B30023H02 1B30035H01 1B30047G01 1C31036H03 1C31051G01 1C31051G02 1C31107G01 1C31107G02 1C31110G01 1C31110G02 1C31110G03 1C31113G01 1C31113G02 1C31113G03 1C31113G04 1C31113G05 1C31113

zhengzhou yuzhe electronic technology co.,ltd

AB DCS 1747 1786

AB DCS 1747 1786

New Equipment |  

MFR. PART NUMBER DESCRIPTION ALLEN BRADLEY 1747-ACN15 CONTROLNET 1.5 AND BEYOND 171 I/O ADAPTER ALLEN BRADLEY 1747-ACNR15 CONTROLNET 1.5 AND BEYOND 171 I/O ADAPTER ALLEN BRADLEY 1747-AIC ISOLATED LINK COUPLER FOR PLC ALLEN BRADLEY 1747-ASB SLC 50

zhengzhou yuzhe electronic technology co.,ltd

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