Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
ProntoPLACE used by electronics manufacturers will quickly program your surface mount SMT and thru-hole assembly equipment. In minutes Unisoft ProntoPLACE software translates CAD or Gerber and Bill of Materials (BOM) files into real reference desig
Hanwha DECAN F2 Pick and Place Machine High Speed:120,000 CPH Ultra Slim Design with a Total Length of 1.25m Applies High Rotary Modular Head Side-view Vision System Product description: Hanwha DECAN F2 Pick and Place Machine High Speed SMT Modular
JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
JUKI JM-100 Hybrid Placement Machine Board size 410×360mmComponent Size: 0603～50mmPlacement Speed:16,000CPHPCB Weight max.4kgProduct description: JUKI JM-100 Multi Task Platform Hybrid Placement Machine, Board size 410×360mm, Component Size: 0603～50
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
Nordson ASYMTEK’s Fids-on-the-Fly™ option is up to 5.5X faster than the traditional stop-and-capture mode for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase UPH as much as 35 percent. Fiducials a
