New Equipment | Board Handling - Conveyors
Bi-directional board inverter Programmable board flow sequence Pass-through function Bi-directional Light tower as status indicator The Board Inverter turns the board upside down to make mounting possible on the secondary side wit
CAT90-M is a manual pick and place system featuring the latest high resolution vision technology. The system is designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pitch QFP’s, and many other SMD’s. Components
From Design to high volume we can assist you in your electronic assembly needs. With two facilities in Calgary and Edmonton Alberta Canada we offer complete manufacturing services. Working along side our metal fabrication shop we can take your prod
New Equipment | Assembly Services
US Based PCB Assembly Contract Manufacturer Since 1987, AGILITY mfg has specialized in the assembly of printed circuit boards and the manufacture of electro-mechanical assemblies for electronic design facilities, engineering firms, and OEM's. We
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pit
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
The Liberty series Bandit (110V) and Sharpshooter (220V) are, simple to operate, Vision Placement rework machines that include a Temperature Profile Controller. Machines may be configured as a single Top Heater reflow system or with an integrated Bot
New Equipment | Board Handling - Storage
Automatic Label Generation And Placement System For In-line PCB Production. PROMATION'S ELC-1100P automatic label placer is a versatile next generation system that allows for high resolution labels to be generated and placed onto circuit boards with
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon