Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
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New Equipment | Coating Equipment
DT-CF-T64412 Desktop Conformal Coating Machine DT-CF-T64412 Desktop Conformal Coating Machine The DT-CF-T64412 Desktop Conformal Coating Machine is a high-precision, efficient solution designed for precise conformal coating applications. Equipped
Lite Fast A-1115-M is a clear UV coating with excellent adhesion to polyester, polycarbonate, polyurethane and many other plastics and cures within seconds. There are two particular functions where this UV adhesive is most frequently used, as a re
Lite Fast A-1175 is a black, medical grade adhesive that cures within seconds after application of Ultraviolet light. Lite Fast A-1175 meets USP Class VI testing with extraction at 37�aC for 72 hours. Independent laboratories that are AALAC accredi
A continuous motion feeder system used for the separation and transfer of needles into syringe hubs. The syringes are then transferred ready for UV or epoxy adhesive application, curing and inspection. Technical Info: Typical line speed up to 1,000
Single & Dual component UV epoxy systems for use as adhesives, coatings and sealants.
New Equipment | Curing Equipment
iCure-2UV is a compact, inline UV curing system. The UV curing oven is suitable for high intensity, rapid curing of UV curable coatings, adhesives, and inks. Standard Features: Edge carrying, variable speed pin chain conveyor Rail expansion comp
Manufacturer of UV cure and thermally cured adhesives and coatings for the electronics, microelectronics industries
WL 66O is one part 100% solid, dual cure UV bonding adhesives, which has been designed for wafer-level lens or optical lens attachment. It can be cured by UV in a few seconds to achieve fast fixing purpose, then further cured by thermal cure to achie
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
