Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
New Equipment | Soldering Robots
Model R50CD (Computer) Heating zones Upper 5/lower 5 Length of heating zone 1730mm PCB width Chain 300mm, mesh 350mm Conveyor chain width range 50-300mm PCB direction L→R or （R→L） Chain fixing Front fix(back fix is optional) Conveyor hei
Adjustable pin chain conveyors, 4 zone preheat section, horizontal reflow position, left to right product flow, touch screen operation, fully integrated controls, SMEMA upstream/downstream interface, bar code capability and all the standard features
R&D Technical Services offers a full line of Single Vapor Reflow Systems. The RD10 provides consistent, uniform and reliable heat transfer in a Belted Inline application for high quality reflow, curing and drying. The RD10 utilizes user friendly cont
The Company ASSCON Systemtechnik-Elektronik GmbH, was founded in 1995 as a development and manufacturing association for progressive and innovative Vapor Phase Reflow Soldering Systems. Today there are hundreds of ASSCON Vapor Phase Soldering System
R&D Technical Services Inc. offers a full line of Single Vapor Batch Type Reflow Systems. The RD1 provides consistent, uniform and reliable heat transfer for high quality reflow, curing and drying. The RD1 utilizes Programmable Logic Controls coupled
The R&D Technical Services VRS unit was specifically designed to treat the external exhaust of reflow systems. The VRS is used to minimize fluid consumption which significantly reduces operating costs. APPLICATION: The model VRS is a high performance
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Painless Profiling for Perfect Oven Recipes When utilizing the AutoM.O.L.E.®Xpert3 System, you are entering a new phase in the thermal management of your automated soldering operations. The new AutoM.O.L.E.®Xpert3 System automatically guides you thr
