New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
Ultimate Precision Accuracy With World-Class Usability. The SE600™ – CyberOptics’ flagship SPI system, is the most advanced, high performance system ever. SE600™ brings together best accuracy and world-class usability on a single platform – making i
The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS. Packaged in a rugged, bench top platform designed for show, engineered for the most advanced measurement requirements found withi
World-Class Accuracy At Fastest Speed. The SE500ULTRA™ system is power-packed with 30% more speed, newly designed V5 series software enabling world class user experience and optional dual illumination sensor. An all-new, improved ultrafast sensor c
80 cm²/sec with zero compromise on measurement accuracy and repeatability. With SE500-D™ you can maximize production utilization and transform your production process to achieve high quality solder joints through accurate volume measurement of solde
With SE500-X™ - 100% 3D solder paste inspection system, CyberOptics pushes inspection speed to the highest level possible. The SE500-X™ is capable of inspecting the most demanding assemblies with 80cm²/sec inspection speed without compromising on mea
Symbion P36 is an inline high-speed API solution that delivers 100% coverage for improving your product quality and boosting your productivity. Post-Paste AOI Instant Programming Easy Gerber Import 2D/3D Laser Path Superior POP™ D
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
