New SMT Equipment: void in lga (Page 1 of 1)

LGA Rework Services

LGA Rework Services

New Equipment | Rework & Repair Services

Reliable LGA Rework Services to Rescue Your Project BEST is your source for LGA rework services. We can optimize our processes to make sure voiding is minimized and the interconnection to all of the IO meets the IPC classification for the assembly.

BEST Inc.

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

China Blind Buried Via Process Circuit Board Manufacturer in Shenzhen

China Blind Buried Via Process Circuit Board Manufacturer in Shenzhen

New Equipment | Assembly Services

Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board 

Shenzhen Kingsheng PCBA Tech CO.,Ltd.

H10 Halogen-Free No Clean Solder Paste

H10 Halogen-Free No Clean Solder Paste

New Equipment | Solder Materials

90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r

AIM Solder

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