New SMT Equipment: voids under qfns (Page 1 of 3)

QFN Rework Services

QFN Rework Services

New Equipment | Rework & Repair Services

BEST's QFN Rework Services Can Save Your Design and Save You Money BEST Inc. provides a variety of QFN rework services including the most popular QFN package styles. BEST has lots of experience in minimizing the voiding in QFN rework. BEST can mini

BEST Inc.

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

Die Attach Solder Paste

New Equipment |  

The Microbond line of die attach solder pastes are the best in the industry. Available in RM and NC vehicle systems. Special grades allow for greater metal loading which results in fewer voids under the die.

OMG Americas

Martin MiniOven-05 - Desktop Reflow Oven

Martin MiniOven-05 - Desktop Reflow Oven

New Equipment | Rework & Repair Equipment

Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos

MARTIN (a Finetech company)

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

New Equipment | Solder Materials

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC

AIM Solder

RAC Prism Software

RAC Prism Software

New Equipment |  

PRISM is the new Reliability Analysis Center (RAC) software tool that ties together several tools into a comprehensive system reliability prediction methodology. The PRISM concept accounts for the myriad of factors that can influence system reliabil

Reliability Analysis Center (RAC) - Permanently closed

RAC Prism Software

New Equipment |  

PRISM is the new Reliability Analysis Center (RAC) software tool that ties together several tools into a comprehensive system reliability prediction methodology. The PRISM concept accounts for the myriad of factors that can influence system reliabil

Reliability Analysis Center (RAC) - Permanently closed

NicAlloy-XT™ Hybrid Stencils

NicAlloy-XT™ Hybrid Stencils

New Equipment | Solder Paste Stencils

Laser Fab, NiPlate™, NanoCoat™. NicAlloy-XT™ stencils are the premier laser-cut stencils in the industry. Beginning life as a laser-cut stencil, followed by a secondary process utilizing Photo Stencil’s own proprietary NiPlate™ technology, which fur

Photo Stencil LLC

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

DEK Green Monster Understencil Wiping Rolls

DEK Green Monster Understencil Wiping Rolls

New Equipment | Solder Paste Stencils

Our DEK Green Monster understencil wiping rolls are comprised of coarse rayon and ESD polyester bonded by a tough proprietary formula of copolymers to make a fabric of high integrity ESD GREEN MONSTER!™ is the only stencil wiping roll to be truly E

Blue Thunder Technologies, Inc.

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