New Equipment | Solder Paste Stencils
Our MPM / Speedline Green Monster Understencil Wiping Rolls are comprised of coarse rayon and ESD polyester bonded by a tough proprietary formula of copolymers to make a fabric of high integrity ESD GREEN MONSTER!™ is the only stencil wiping roll t
New Equipment | Solder Paste Stencils
Our EKRA Green Monster Understencil Wiping Rolls are comprised of coarse rayon and ESD polyester bonded by a tough proprietary formula of copolymers to make a fabric of high integrity ESD GREEN MONSTER!™ is the only stencil wiping roll to be truly
ScanINSPECT VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in process setup and new product introduction in the PCB or Hybrid Microcircuit assembly industries. ScanINSPECT VPI
Our leading products are researched, developed and manufactured at Keteca USA, in Phoenix Arizona. Solution to bonding problem? Keteca Diamaflow is the Answer! The Sub-Micron Technology of today and the future requires continued improved methods to
New Equipment | Solder Materials
Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the
Model No.: K0481 Product Origin: China Price Terms: FOB Shenzhen Payment Terms: T/T in advance Delivery Lead Time: within 7 days Features: 1) Made of highly absorbent, non-woven fabrics for removing spills or misprints 2) Superb tensile strength
New Equipment | Wave Soldering
Vitronics Soltec’s Delta platform has evolved over generations of equipment, with thousands of machines operating worldwide. The Delta 5 represents our latest wave soldering solution, featuring easy setup and operation and is the most reliable, depen
New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
New Equipment | Solder Materials
KappAloy20™ - 80%Sn - 20%Zn For soldering of Aluminum to Aluminum and Aluminum to Copper. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15
Auto stencil cleaning: Standard Specification, including Wet wiping, dry wiping and Exhaust the air. Humanity software: Easy to learn and operate. Blade working under stencil or depart from stencil; it will not move up and down; to ensure the stead
