New SMT Equipment: wirebonded (Page 1 of 1)

NxGenElectronics.com

NxGenElectronics.com

New Equipment |  

Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging

NxgenElectronics

Capital Equipment

New Equipment |  

BGA/SMD Rework & Repair Stations, Selective Soldering Machines, Fume Extraction Equipt., Man. & Semiauto Wirebonders, Man. & Auto SMD Componnent Tape & Reel Machines, Man. & Motorized Parts Counters, Peel Force Testers, X-Ray Equipt.

M&M Associates

Decapsulation Services

Decapsulation Services

New Equipment | Rework & Repair Equipment

MLT provides laser decapsulation, "decap", services for removing encapsulation or mold compounds for accessing wirebonds, die, leadframes, and substrates.

Micron Laser Technology

Electronic Assembly Materials

New Equipment |  

Cermet Thick Film Materials, Au & Al Wire for Wirebonding, Flip Chip Underfills, Encapsulants, Potting Compounds, Paste & Film Adhesives, COB Die Attach, Solder Alternatives, Conformal Coatings, Vacuum Pick-up Tool, W/B Capallaries and Die Collets

M&M Associates

S2088BO-II – Reliable Wirebond Control with Desktop AO

S2088BO-II – Reliable Wirebond Control with Desktop AO

New Equipment | Inspection

This compact AOI system was developed to inspect medium and small product runs. During inspection, a high-resolution camera records all bond sites and wires. Dies, bond sites, wire course and component position are only a part of the inspection scope

Viscom AG

UV Curable Glob Top and Dam-and-Fill Encapsulants

UV Curable Glob Top and Dam-and-Fill Encapsulants

New Equipment | Materials

For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline

Zymet, Inc

MVP 850 DWMS

MVP 850 DWMS

New Equipment | Inspection

The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-

Machine Vision Products, Inc

850G Die Placement AOI

850G Die Placement AOI

New Equipment | Inspection

Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu

Machine Vision Products, Inc

Mega™ ION Batch PCB Cleaners

Mega™ ION Batch PCB Cleaners

New Equipment | Cleaning Equipment

World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel Construction Automatic Wash/Rinse/Test/Dry 230VAC, 10AMP, 50/60Hz

Austin American Technology

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